Wafer reinforcement to reduce wafer curvature
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United States of America Patent
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Dec 26, 2017
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N/A
app pub date -
Oct 2, 2015
filing date -
Oct 2, 2015
priority date (Note) -
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Abstract
A semiconductor structure includes filled dual reinforcing trenches that reduce curvature of the semiconductor structure by stiffening the semiconductor structure. The filled dual reinforcing trenches reduce curvature by acting against transverse loading, axial loading, and/or torsional loading of the semiconductor structure that would otherwise result in semiconductor structure curvature. The filled dual reinforcing trenches may be located in an array throughout the semiconductor structure, in particular locations within the semiconductor structure, or at the perimeter of the semiconductor structure.
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