CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
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United States of America Patent
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Apr 6, 2017
app pub date -
Sep 29, 2016
filing date -
Oct 1, 2015
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Abstract
This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, wherein the first top surface has a first insulating layer formed thereon, and the sensing chip comprises a sensing device adjacent to the first top surface and a plurality of conductive pads formed within the first insulating and adjacent to the sensing device, and a wiring layer formed on the first bottom surface to respectively connect to each of the conductive pads; and a dam formed on the first insulating layer adjacent to the sensing device.
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