Electronic Component and Process of Producing Electronic Component
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United States of America Patent
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app pub date -
Oct 12, 2015
filing date -
Oct 12, 2015
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Abandoned
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Abstract
Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate and a thermal grain modified layer positioned on the substrate. The thermal grain modified layer includes a modified grain structure. The modified grain structure includes a thermal grain modification additive. A method for forming the electronic component is also disclosed.
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