Importance

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Abstract

The invention concerns a process for producing a security film, comprising:

a. forming a polymeric film substrate having first and second surfaces;b. plasma treating at least one surface of the polymeric film substrate using a modified atmosphere plasma treatment, wherein the modified atmosphere comprises at least one inert carrier gas and at least one functional material selected from:i. one or more oxidising fluids;ii. one or more reducing fluids; andiii. one or more polar fluids with the capacity to form ionic or covalent bonds with the at least one surface of the polymeric film substrate,wherein those oxidising fluids with a relative dielectric strength less than that of air, where present, are in the modified atmosphere in an amount less than 40% by weight or by volume; andc. contacting a foil with the at least one plasma treated surface of the polymeric film substrate such that the foil adheres to the polymeric film substrate.

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First Claim