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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SAMSUNG ELECTRO-MECHANICS CO LTD	GYEONGGI DO SOUTH KOREA GYEONGGI-DO

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
• G01D:MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VAR....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
JEONG, Dae Hun	Suwon-si, KR	25	52
LEE, Tae Hun	Suwon-si, KR	40	141
LIM, Chang Hyun	Suwon-si, KR	95	565

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Oct 13, 2024
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Oct 13, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2017/0101,307

SEMICONDUCTOR PACKAGE

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