Conductive paste

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10332649
APP PUB NO 20170103824A1
SERIAL NO

15129120

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Abstract

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A conductive paste includes: a silver-coated resin; and an organic vehicle that includes a thermosetting resin composition, a curing agent, and a solvent, in which the thermosetting resin composition is an epoxy resin composition which is solid at room temperature and has a melt viscosity of 0.5 Pa·s or lower at 150° C., and a mass ratio of a content of the thermosetting resin composition to a content of the silver-coated resin is 10 to 40:60 to 90.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 100-8117
MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO LTDAKITA-SHI AKITA 010-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higano, Satoko Naka-gun, JP 17 30
Kageyama, Kensuke Akita, JP 23 127
Tsukada, Hirokazu Akita, JP 6 28
Yamasaki, Kazuhiko Naka-gun, JP 49 223

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