Process of Producing Electronic Component and an Electronic Component
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United States of America Patent
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Issued Date -
Apr 13, 2017
app pub date -
Oct 12, 2015
filing date -
Oct 12, 2015
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Abstract
Electronic components and processes of producing electronic components are disclosed. A process of producing a component includes positioning a substrate having a non-planar surface, applying a metalizing material on the surface, and energetically beam-melting the metalizing material to produce a metalized electrical contact on the component. A component includes a substrate having a non-planar surface, and a printed and energetically beam-melted metalized electrical contact positioned on the non-planar surface. Additionally or alternatively, a component includes a substrate having a surface, and a rotationally-applied and energetically beam-melted metalized electrical contact positioned on the substrate.
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