Rotational Sensor
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United States of America Patent
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app pub date -
Sep 28, 2016
filing date -
Oct 15, 2015
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sensor package is provided. The sensor package comprises a first lead comprising a first anchoring area configured to anchor the first lead to a package body; a second lead comprising a second anchoring area configured to anchor the second lead to the package body; a sensor component; and a capacitor coupled between the first and second anchoring areas.
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