CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Apr 20, 2017
app pub date -
Sep 27, 2016
filing date -
Oct 16, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A chip package includes a chip, a dam element, and a height-increasing element. The chip has an image sensing area, a first surface, and a second surface opposite to the first surface. The image sensing area is located on the first surface of the chip. The dam element is located on the first surface of the chip and surrounds the image sensing area. The height-increasing element is located on the dam element, such that the dam element is between the height-increasing element and the chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully