Semiconductor device and method of manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10784256
APP PUB NO 20170111037A1
SERIAL NO

15282215

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Abstract

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A semiconductor device includes a plurality of semiconductor switching elements disposed on a single semiconductor substrate comprising a semiconductor having a bandgap that is wider than that of silicon; and a plurality of electrode pads that are disposed in a predetermined planar layout on a front surface of the semiconductor substrate, the plurality of electrode pads each being electrically connected to the plurality of semiconductor switching elements. A plurality of terminal pins to externally carry out voltage of the electrode pads is bonded through a plated film to all of the plurality of electrode pads by solder.

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Patent Owner(s)

  • FUJI ELECTRIC CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Yuichi Matsumoto, JP 61 424
Hoshi, Yasuyuki Matsumoto, JP 73 192
Shiigi, Takashi Matsumoto, JP 20 153
Yamada, Shoji Matsumoto, JP 91 1250

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