Electronics housing and manufacturing method
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United States of America Patent
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Jan 16, 2018
Issued Date -
N/A
app pub date -
Oct 4, 2016
filing date -
Oct 15, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronics housing for the accommodation of at least one electronic component in an interior space defined by the electronics housing and at least partly enclosed by an exterior wall of the electronics housing is provided. The electronics housing exhibiting at least one pressure-equalizing element which enables an equalization of pressure between the interior space and an exterior space surrounding the electronics housing. The pressure-equalizing element is constituted by a gas-permeable wall portion of the exterior wall, on which the exterior wall exhibits a pore structure as a result of local foaming of the material from which the exterior wall has been produced.
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Family
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Cited Art Landscape
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