RESIN COMPOSITION AND FORMED ARTICLE THEREOF

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United States of America Patent

SERIAL NO

15316849

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Abstract

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Disclosed is a resin composition including a polyamide (A), a polyester (B) and a white pigment (C), wherein (A) has a melting point of 280° C. or higher, (B) is polycyclohexylenedimethylene terephthalate, a mass ratio (A/B) is 5/95 to 95/5, and a content of (C) is 10 to 150 parts by mass in relation to 100 parts by mass of a total amount of (A) and (B).

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Patent Owner(s)

Patent OwnerAddress
UNITIKA LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amari, Taiyo Kyoto, JP 4 14
Kabashima, Yohei Kyoto, JP 11 83
Kamikawa, Hiroo Kyoto, JP 18 76
Mii, Junichi Kyoto, JP 4 14

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