CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING BETWEEN ELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
Apr 27, 2017
app pub date -
Oct 22, 2015
filing date -
Oct 22, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A module includes a circuit package, which includes multiple electronic components on a substrate, a molded compound. The molded compound is disposed over the substrate and the electronic components, and defines at least one trench feature, at least a portion of which is during application of the molded compound. The trench feature extends from a top surface of the molded compound toward the substrate between adjacent electronic components. An external shield may be disposed on at least one outer surface of the circuit package and is electrically connected to ground for protecting the circuit package from external electromagnetic radiation and environmental stress. The trench feature includes an electrically conductive material that provides an internal shield, electrically connected to ground and configured to shield one of the adjacent electronic components, between which the trench feature extends, from electromagnetic radiation generated by the other adjacent electronic component.
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