CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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app pub date -
Oct 19, 2016
filing date -
Oct 21, 2015
priority date (Note) -
Abandoned
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Abstract
A chip package is provided. The chip package includes a substrate. The substrate includes a sensing region or device region. The chip package also includes a first conducting structure disposed on the substrate. The first conducting structure is electrically connected to the sensing region or device region. The chip package further includes a passive element vertically stacked on the substrate. The passive element and the first conducting structure are positioned side by side.
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