Substrate treating apparatus
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United States of America Patent
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Dec 25, 2018
Grant Date -
May 4, 2017
app pub date -
Oct 24, 2016
filing date -
Oct 29, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus for treating a substrate is provided having a treating module, a buffer module, and an index module arranged in sequentially along a first direction. The index module includes a load port where a substrate receiving container places an index module configured to transfer the substrate between the load port and the buffer module. The buffer module includes a first and second buffer unit arranged along a second direction perpendicular to the first direction. The treating module includes a first treating unit, a second treating unit, a first transfer chamber, and a second transfer chamber, wherein the first transfer chamber includes a first transfer robot configured to transfer the substrate between the first buffer unit and the first treating unit, and wherein the second transfer chamber includes a second transfer robot configured to transfer the substrate between the second buffer unit and the second treating unit.
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