Molded printhead structure

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United States of America Patent

PATENT NO 9889664
SERIAL NO

15372366

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies.

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Patent Owner(s)

  • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hua Corvallis, US 404 2914
Cumbie, Michael W Albany, US 269 892

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