Integration of bonded optoelectronics, photonics waveguide and VLSI SOI

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United States of America Patent

PATENT NO 9977185
SERIAL NO

15347046

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Abstract

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An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Budd, Russell A North Salem, US 99 1892
Leobandung, Effendi Stormville, US 536 4748
Li, Ning White Plains, US 707 4047
Plouchart, Jean-Olivier New York, US 77 844
Sadana, Devendra K Pleasantville, US 897 9891

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