Wafer debonding using mid-wavelength infrared radiation ablation

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United States of America Patent

PATENT NO 10297479
APP PUB NO 20170125268A1
SERIAL NO

15403937

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Abstract

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Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dang, Bing Chappaqua, US 159 1434
Knickerbocker, John U Yorktown Heights, US 263 3932
Tsang, Cornelia Kang-I Mohegan Lake, US 28 542

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