Structures for preventing dicing damage

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United States of America Patent

PATENT NO 9759868
SERIAL NO

14933705

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Abstract

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The disclosure relates to semiconductor structures and, more particularly, to structures for preventing dicing damage on photonics wafers. The structure includes: an optical waveguide structure to optical fiber interface formed on an integrated circuit; and a groove formed in a substrate and which includes a structure preventing a fluid pressure of a dicing operation from damaging the substrate along the groove.

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Patent Owner(s)

  • IBM CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cucci, Brett Callicoon, US 4 2
Fortier, Paul F Richelieu, CA 27 238
Gambino, Jeffrey P Portland, US 531 7344
Leidy, Robert K Burlington, US 100 1695
Liu, Qizhi Lexington, US 213 1353
Rassel, Richard J Essex Junction, US 58 1038

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