Method to produce a semiconductor wafer for versatile products

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United States of America Patent

PATENT NO 9865503
SERIAL NO

15330781

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Abstract

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Aspects of the disclosure provide a method for semiconductor wafer manufacturing. The method includes utilizing a subset of lower level masks in a mask set to form multiple modular units of lower level circuit structures on a semiconductor wafer. The mask set includes the subset of lower level masks and at least a first subset of upper level masks and a second subset of upper level masks. The first subset of upper level masks defines intra-unit interconnections. The second subset of upper level masks defines both intra-unit interconnections and inter-unit interconnections. The method further includes selecting one of at least the first subset of upper level masks and the second subset of upper level masks based on a composition request of a final integrated circuit (IC) product and utilizing the selected subset of upper level masks to form upper level structures on the semiconductor wafer.

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Patent Owner(s)

  • MARVELL ISRAEL (M.I.S.L.) LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Peled, Itay Hagor, IL 29 131
Rotem, Eran Haifa, IL 13 97
Zemach, Rami Givat Shapira, IL 54 338

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