Semiconductor package and fabricating method thereof

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United States of America Patent

PATENT NO 9852976
SERIAL NO

15400041

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Abstract

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A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.

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Patent Owner(s)

Patent OwnerAddress
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD491B RIVER VALLEY ROAD VALLEY POINT #12-03 SINGAPORE 248373

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiner, David Chandler, US 21 599
Huemoeller, Ronald Gilbert, US 35 413
Kelly, Michael Queen Creek, US 170 4797
St, Amand Roger Tempe, US 19 797

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