SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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May 11, 2017
app pub date -
Nov 9, 2015
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Nov 9, 2015
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Abstract
A semiconductor device and a manufacturing method thereof, which can reduce a number of manufacturing processes and/or can reduce a thickness of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for the elimination process steps and/or a reduction in package size based on dielectric layer characteristics.
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