Bonding substrates using solder surface tension during solder reflow for three dimensional self-alignment of substrates
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United States of America Patent
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Jul 11, 2017
Grant Date -
May 11, 2017
app pub date -
Nov 10, 2015
filing date -
Nov 10, 2015
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Abstract
Methods are provided for bonding substrates together using alignment structures and solder reflow techniques which achieve self-alignment in three dimensions, as well as semiconductor structures that are formed using such methods. A first alignment structure is formed on a bonding surface of a first substrate, which includes an alignment trench formed in the bonding surface of the first substrate. A second alignment structure is formed on a bonding surface of a second substrate, which includes a bonding pad with solder formed on the bonding pad. The first and second substrates are placed together with the solder of the second alignment structure in contact with the first alignment structure. A solder reflow process causes the solder to melt and flow into the alignment trench while pulling on the bonding pad to cause the second substrate to move into alignment with the first substrate in each of X, Y, and Z directions.
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