CONDUCTIVE FILM LAMINATE, CONDUCTOR, MANUFACTURING METHOD OF CONDUCTOR

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United States of America Patent

SERIAL NO

15420180

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Abstract

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A conductive film laminate includes: an insulating support having a flat plate shape; and a conductive film which is bonded onto a surface of the support with an adhesive, in which the conductive film includes an insulating substrate having flexibility and a conductive layer which is disposed on a surface of the insulating substrate, and the insulating substrate includes at least one opening formed by cutout of a portion where forming strain is concentrated, when forming the conductor, and the opening is covered with the support.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIYAMOTO, Haruhiko Ashigara-kami-gun, JP 7 19

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