OXIDE SINTERED BODY, SPUTTERING TARGET, AND OXIDE SEMICONDUCTOR THIN FILM OBTAINED USING SPUTTERING TARGET

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United States of America Patent

APP PUB NO 20170137324A1
SERIAL NO

15319569

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Abstract

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Provided are an oxide sintered compact whereby low carrier density and high carrier mobility are obtained when the oxide sintered compact is used to obtain an oxide semiconductor thin film by a sputtering method, and a sputtering target which uses the oxide sintered compact. This oxide sintered compact contains, as an oxide, one or more positive divalent elements selected from the group consisting of indium, gallium, nickel, cobalt, calcium, strontium, and lead. The gallium content is less than 0.08 to 0.20 in terms of Ga/(In+Ga) atomic ratio, and the positive dyad (M) content is 0.0001 to 0.05 in terms of M/(In+Ga+M) atomic ratio. In a crystalline oxide semiconductor thin film formed using the oxide sintered compact as a sputtering target, the carrier density is less than 1×1018 cm−3, and the carrier mobility is at least 10 cm2V−1sec−1.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO METAL MINING CO LTD11-3 SHIMBASHI 5-CHOME MINATO-KU TOKYO 1058716

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWARA, Masashi Ome-shi, JP 13 13
MATSUMURA, Fumihiko Ome-shi, JP 16 58
NAKAYAMA, Tokuyuki Ome-shi, JP 51 385
NISHIMURA, Eiichiro Ome-shi, JP 18 86

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