PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170137944A1
SERIAL NO

15322635

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This plasma processing apparatus is provided with a processing container, a placing table, a gas supply mechanism, a plasma generating mechanism, and an adjustment unit. The placing table is provided in the processing container, and a subject to be processed is placed on the placing table. The gas supply mechanism supplies a processing gas to the inside of the processing container, said processing gas being to be used for the purpose of plasma reaction. The plasma generating mechanism includes a microwave oscillator, and brings the processing gas supplied to the inside of the processing container into the plasma state using microwaves oscillated by means of the microwave oscillator. In the cases of performing a plurality of steps for plasma-processing the subject, the adjustment unit adjusts, at timing of switching the steps, the frequencies of the microwaves to be oscillated by means of the microwave oscillator to target frequencies predetermined for respective steps.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ICHIKAWA, Yusuke Miyagi, JP 20 30
KUBOTA, Shinji Miyagi, JP 108 966

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