Printed circuit board structure and method of manufacturing using wideband microstrip lines

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United States of America Patent

PATENT NO 10027010
SERIAL NO

14943938

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Abstract

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There is provided a printed circuit board structure, a dielectric substrate structure and a method of manufacturing thereof using wideband microstrip lines for reducing signal reflection, resonance and radiation for maintaining signal quality. The widths of certain portions of the wideband microstrips and underlying substrate portions are tapered gradually for achieving a reduction in a signal reflection, resonance and radiation therefore resulting in maintaining signal quality.

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Patent Owner(s)

  • UNITED ARAB EMIRATES UNIVERSITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beg, Azam Al Ain, AE 4 4
Ramzan, Rashad Al Ain, AE 12 11
Sidiqui, Omar Farooq Madinah, SA 3 3

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