Encapsulation of acoustic resonator devices

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United States of America Patent

PATENT NO 10069474
APP PUB NO 20170141756A1
SERIAL NO

15137662

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Abstract

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A device includes an acoustic resonator embedded within an encapsulating structure that at least partially encapsulates the acoustic resonator. The device includes an inductor electrically connected to the acoustic resonator. At least a portion of the inductor is embedded in the encapsulating structure.

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Patent Owner(s)

  • QUALCOMM INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berdy, David Francis San Diego, US 61 433
Kim, Daeik Daniel Del Mar, US 84 609
Kim, Jonghae San Diego, US 314 3452
Lan, Je-Hsiung Jeffrey San Diego, US 32 307
Ma, Yunfei Santa Clara, US 30 106
Mikulka, Robert Paul Oceanside, US 25 171
Mudakatte, Niranjan Sunil San Diego, US 45 222
Velez, Mario Francisco San Diego, US 123 1130
Yun, Changhan Hobie San Diego, US 135 894
Zuo, Chengjie San Diego, US 146 1291

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