METHOD AND APPARATUS FOR SELECTING A PASTE STENCIL FOR PASTE PRINTING AND FOR APPLYING PASTE ONTO A SUBSTRATE BY MEANS OF THE SELECTED PASTE STENCIL
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United States of America Patent
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Issued Date -
May 25, 2017
app pub date -
Nov 18, 2016
filing date -
Nov 20, 2015
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Abstract
A method and an apparatus for selecting a paste stencil (10) for paste printing onto a substrate (20), the paste stencil (10) being selected on the basis of a stencil thickness (h), in the case of which an area ratio of a small through opening (11a, 11b) of the substrate is greater than or equal to a setpoint area ratio. Furthermore, the present disclosure relates to a method and an apparatus for applying paste material (30) onto a substrate (20) for at least one small component (21a, 21b) and at least one large component (22) which is larger than the at least one small component (21a, 21b), paste material (30) being applied for the at least one small component (21a, 21b) and the at least one large component (22) by means of a paste stencil (10) which is selected according to the invention, and additional paste material (30) being applied onto the paste material (30) for the at least one large component (22), after paste material (30) has been applied by means of the selected paste stencil (10) for the at least one small component (21a, 21b) and the at least one large component (22).
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