CHIP PACKAGE AND METHOD FOR FORMING THE SAME
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United States of America Patent
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Issued Date -
May 25, 2017
app pub date -
Nov 21, 2016
filing date -
Nov 23, 2015
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Abstract
A method for forming a chip package is provided. The method includes providing a device substrate including a sensing device and conductive pads that are exposed from a surface of the device substrate. The method further includes forming a conductive structure correspondingly on each of the conductive pads, and then covering the surface of the device substrate with a hard coating layer that completely covers the respective conductive structures on the conductive pads. The method further includes thinning the hard coating layer to expose the respective conductive structures on the conductive pads. The hard coating layer and the respective conductive structures on the conductive pads have substantially planar surfaces that are level with each other. A chip package is also provided.
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