Method of wafer level packaging of a module
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United States of America Patent
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app pub date -
Nov 22, 2015
filing date -
Nov 22, 2015
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Abandoned
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Abstract
The method of a wafer level packaging includes preparing a substrate, assembling a system on a first side of the substrate, and placing solder balls on a second side of the substrate. The soldering balls s fixed on to the second side of the substrate after the module has been assembled.
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