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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SEIKO EPSON CORPORATION	TOKYO 160-8801

International Classification(s)

• B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
• B22D:CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY ....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
KAMAKURA, Tomoyuki	Matsumoto-shi, JP	44	514
KOGA, Yoshiro	Shiojiri-shi, JP	58	458
MIYASHITA, Takeshi	Suwa-shi, JP	72	753

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Dec 1, 2024
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 1, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2017/0151,606

MOLDING-MATERIAL SUPPLYING MECHANISM AND MOLDING APPARATUS

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