LOW-CURRENT FUSE STAMPING METHOD

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United States of America Patent

SERIAL NO

15428266

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A convenient, cost-effective method for manufacturing low-current fuse elements. The method may include the steps of stamping a substrate out of a sheet of material and stamping at least one hole in the substrate. The method may further include the steps of bonding a layer of fuse material to a surface of the substrate with a portion of the fuse material covering the hole, stamping a fuse element out of the portion of fuse material covering the hole, and separating an individual fuse from the fuse material and the substrate. A low-current fuse can thereby be obtained using an easily performed stamping process.

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Patent Owner(s)

Patent OwnerAddress
LITTELFUSE INC8755 WEST HIGGINS ROAD SUITE 500 CHICAGO IL 60631

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beckert, James J Rolling Meadows, US 19 170
Shierry, Stephen R Villa Park, US 3 20
Stumpo, Gregory G Schaumburg, US 3 7

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