COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS

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United States of America Patent

SERIAL NO

15327389

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Abstract

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The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.

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Patent Owner(s)

Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBH10553 BERLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BREITFELDER, Jana Berlin, DE 3 3
KURTZ, Olaf Berlin, DE 15 99
RUETHER, Robert Lehnitz, DE 5 8

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