PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE

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United States of America Patent

APP PUB NO 20170162488A1
SERIAL NO

15439721

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.

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Patent Owner(s)

Patent OwnerAddress
INTERSIL AMERICAS LLC1001 MURPHY RANCH ROAD MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carpenter,, JR Loyde Milton Palm Bay, US 7 2
Kelkar, Nikhil Vishwanath Saratoga, US 32 532
Yin, Jian San Ramon, US 79 1602

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