PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE
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United States of America Patent
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Issued Date -
Jun 8, 2017
app pub date -
Feb 22, 2017
filing date -
May 23, 2012
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Abstract
Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.
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