SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Jun 8, 2017
app pub date -
May 9, 2016
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Dec 4, 2015
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Abstract
A semiconductor device and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing a semiconductor package, and a semiconductor package resulting therefrom, that comprises attaching at least one semiconductor die to a metal plate, encapsulating the at least one semiconductor die on the metal plate using an encapsulant, and dicing the metal plate and the encapsulant.
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