IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE SYSTEM
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United States of America Patent
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app pub date -
Feb 27, 2017
filing date -
Jan 5, 2015
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Abandoned
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Abstract
An imaging unit includes: a semiconductor package having an image sensor and having a first connection electrode on a back face thereof; a first multi-layer substrate having layered substrates and having second and third connection electrodes respectively on front and back faces of the first multi-layer substrate, the second connection electrode being configured to be connected to the first connection electrode; a second multi-layer substrate having layered substrates, the second multi-layer substrate being configured to be connected to the back face of the first multi-layer substrate such that a layer direction of the second multi-layer substrate is perpendicular to a layer direction of the first multi-layer substrate; an electronic component mounted inside the first multi-layer substrate; and cables configured to be connected to the second multi-layer substrate. The first and second multi-layer substrates lie within a projected plane in an optical axis direction of the semiconductor package.
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