Device for the separate application of bonding material deposits
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United States of America Patent
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Jun 30, 2020
Grant Date -
Jun 15, 2017
app pub date -
Jul 15, 2015
filing date -
Jul 15, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A device for the application of solder material deposits includes a conveying device for conveying solder material deposits from a reservoir at an upper housing part toward an application device at a lower housing part. The conveying device can be moved from a receiving position P1 to a transfer position P2, in which the solder material deposit is exposed to a pressure gas via a pressure bore formed in the upper housing part and from which the solder material deposit is transferred to an application nozzle in an application position P3. The application device includes an application duct formed in the lower housing and forms a lower section of a transmission duct which serves to transmit laser radiation to the solder in the application nozzle. The application duct is inclined at an application angle α with respect to the rotation axis.
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