ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS
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United States of America Patent
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Issued Date -
Jun 15, 2017
app pub date -
Dec 14, 2015
filing date -
Dec 14, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electronic package that includes a substrate; a die attached to the substrate; an underfill positioned between the die and the substrate due to capillary action; a first support adjacent to the die and attached to the substrate; and a second support mounted on the first support, wherein the second support is closer to the die than the first support, wherein first support surrounds the die and the second support surrounds the die, and wherein the second support is a different material than the first support. The die may be flip chip bonded to the substrate and the underfill may secure the die to the substrate. The first support may be attached to the substrate using an adhesive and the second support may be attached to the first support using an adhesive.
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Family
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Cited Art Landscape
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