ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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Issued Date -
Jun 15, 2017
app pub date -
Dec 4, 2016
filing date -
Dec 11, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic device includes a conductive layer, a device die, and a connecting member. The conductive layer is formed by coating a conductive material on a substrate. The device die and the connecting member are disposed on the conductive layer and spaced from each other. The device die includes a first connection point on one side that is in contact with and electrically connected to the conductive layer, and a second connection point on another side thereof. The connecting member includes a third connection point on a side thereof electrically connected to and in contact with the conductive layer, and a fourth connection point on another side thereof. The second and fourth connection points are configured to provide external connections of the electronic device.
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