Importance

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Abstract

A semiconductor device includes an n− type layer disposed in a first surface of an n+ type silicon carbide substrate, a first trench and a second trench disposed in the n− type layer and spaced apart from each other, a p type region surrounding a lateral surface and a corner of the first trench, an n+ type region disposed on the p type region and the n− type layer between the first trench and the second trench, a gate insulating layer disposed in the second trench, a gate electrode disposed on the gate insulating layer, an oxide layer disposed on the gate electrode, a source electrode disposed on the oxide layer and the n+ type region, and disposed in the first trench, and a drain electrode disposed in a second surface of the n+ type silicon carbide substrate, wherein the source electrode contacts the n− type layer.

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First Claim