METHOD FOR ADHERING METAL LAYER AND POLYMER LAYER AND METHOD FOR MANUFACTURING METAL ELECTRODE
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United States of America Patent
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Issued Date -
Jun 22, 2017
app pub date -
Jul 29, 2016
filing date -
Dec 17, 2015
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Abstract
A method for adhering a metal layer and a polymer layer includes forming a metal layer, forming a nanoporous metal structure on the metal layer, and compressing a polymer layer on the nanoporous metal structure such that a polymer is infiltrated into the nanoporous metal structure.
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