SPUTTERING SOURCE ARRANGEMENT, SPUTTERING SYSTEM AND METHOD OF MANUFACTURING METAL-COATED PLATE-SHAPED SUBSTRATES
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United States of America Patent
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Dec 3, 2014
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Dec 4, 2013
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For coating substrates (S) having along their surfaces to be coated high aspect ratio vias, a sputtering system has a sputtering source arrangement, which includes a first DC pulse operated magnetron sub-source (1203) and a second frame-shaped magnetron sub-source (1213) which latter is arranged, in the system, between the substrate (S) and the first magnetron sub-source (1203). The second magnetron sub-source (1213) may be operated in DC, pulsed DC, thereby also HIPIMS mode. The first magnetron sub-source (1203) is advantageously also operated in HIPIMS mode. The substrate (S) is biased by an Rf power source (1253).
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