CTE-matched heat pipe

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United States of America Patent

PATENT NO 10247486
APP PUB NO 20170176112A1
SERIAL NO

15448949

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
THERMAL CORP103 FOULK ROAD SUITE 102 WILMINGTON DE 19803

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garner, Scott Lititz, US 19 264
Hartenstine, John Mountville, US 6 67
Sarraf, David Elizabethtown, US 11 150
Toth, Jerome Exton, US 5 26

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