Electronic component and methods of manufacturing the same
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United States of America Patent
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Issued Date -
Jun 22, 2017
app pub date -
Dec 18, 2016
filing date -
Dec 18, 2015
priority date (Note) -
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Abstract
An electronic component which comprises an electrically insulating layer having at least one through hole, a patterned electrically conductive structure at least partially on the electrically insulating layer, an electronic chip electrically coupled with the patterned electrically conductive structure, an encapsulant at least partially encapsulating the electronic chip, and at least one electrically conductive contact structure at least partially in the at least one through hole in contact with at least part of the patterned electrically conductive structure.
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