STACKED INDUCTOR-ELECTRONIC PACKAGE ASSEMBLY AND TECHNIQUE FOR MANUFACTURING SAME

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United States of America Patent

SERIAL NO

15453889

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Abstract

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An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.

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Patent Owner(s)

Patent OwnerAddress
INTERSIL AMERICAS LLC1001 MURPHY RANCH ROAD MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kelkar, Nikhil Vishwanath Saratoga, US 32 532
MOUSSAOUI, ZAKI PALM BAY, US 70 456

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