BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
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United States of America Patent
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app pub date -
Dec 18, 2015
filing date -
Dec 18, 2015
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Abstract
Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.
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