METHOD OF PRODUCING SILICON CARBIDE EPITAXIAL SUBSTRATE, SILICON CARBIDE EPITAXIAL SUBSTRATE, AND SILICON CARBIDE SEMICONDUCTOR DEVICE

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United States of America Patent

SERIAL NO

15443785

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Abstract

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A method of producing a silicon carbide epitaxial substrate includes steps of: preparing a silicon carbide substrate; and forming a silicon carbide layer on the silicon carbide substrate. In this production method, in the step of forming the silicon carbide layer, a step of growing an epitaxial layer and a step of polishing a surface of the epitaxial layer are repeated twice or more.

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Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0041

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiyoshi, Toru Osaka-shi, JP 121 603

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