Methods for magnetic sensor having non-conductive die paddle

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10333055
APP PUB NO 20170179377A1
SERIAL NO

15447320

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ALLEGRO MICROSYSTEMS LLC955 PERIMETER ROAD MANCHESTER NH 03103-3353

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doogue, Michael C Bedford, US 85 4730
Milano, Shaun D Dunbarton, US 37 2640
Taylor, William P Amherst, US 182 5961

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Dec 25, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 25, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00